English  |  正體中文  |  简体中文  |  Post-Print筆數 : 27 |  Items with full text/Total items : 110182/141115 (78%)
Visitors : 46620915      Online Users : 800
RC Version 6.0 © Powered By DSPACE, MIT. Enhanced by NTU Library IR team.
Scope Tips:
  • please add "double quotation mark" for query phrases to get precise results
  • please goto advance search for comprehansive author search
  • Adv. Search
    HomeLoginUploadHelpAboutAdminister Goto mobile version
    Please use this identifier to cite or link to this item: https://nccur.lib.nccu.edu.tw/handle/140.119/112810


    Title: 全球半導體封裝測試產業研發效率與獲利效率及其影響因子分析
    An analysis of impact factor of R&D and profitability efficiency for global semiconductor assembly and testing industry
    Authors: 陳柏宇
    Chen, Po Yu
    Contributors: 許牧彥
    陳柏宇
    Chen, Po Yu
    Keywords: 封裝測試產業
    資料包絡分析
    獲利效率
    研發效率
    Tobit迴歸
    Semiconductor assembly and testing industry
    Profitability efficiency
    R&D efficiency
    DEA
    Tobit regression
    Date: 2017
    Issue Date: 2017-09-13 15:50:24 (UTC+8)
    Abstract: 近年半導體封裝產業發生多起併購案件,令人不禁好奇該產業發生之變化及對未來之影響。本研究針對全球半導體封測產業市場佔有率前十名之廠商,以包絡分析法進行CCR模式及BCC模式之研發效率及獲利效率。第一階段研究2012~2014年目標廠商之研發資源運用效率,投入項為研發費用及知識存量(加權累積專利數),產出項為專利權數量;第二階段研究2014~2016年目標廠商之獲利效率,投入項為專利資本及銷售與管理費用,產出項為營業毛利。分析完個別之研發效率及獲利效率後,再將兩者以Pearson相關性分析檢測其相關係數,證實研發效率與獲利效率僅有低度相關。此外為探討日月光及矽品兩企業併購案,本研究將該兩家廠商之投入產出項合併進行另一次DEA包絡分析。研究結果發現整體產業呈現有效率狀態,以平均整體效率而言,研發效率及獲利效率皆達0.7。另外BCC模式下之技術效率表現更佳,惟規模效率部分表現較差,研究發現中度規模廠商(市佔率排名6至10之廠商)多處於規模報酬遞增的狀態,而規模程度高之廠商(如日月光、Amkor)則為規模報酬遞減之狀態。因此研究推論大者恆大之現象確實存在,然規模太大之廠商可能反而出現資源分配不均、整合程度不足等因素所造成的規模無效率。再以Tobit迴歸分析尋找影響效率因子,證實規模對於無論研發或是獲利效率均無顯著影響,研發效率的顯著因子有申請專利變動幅度,說明企業應有效規畫管理研發產出;獲利效率顯著因子包含直接生產力與銷管能力,證實成本控制為該產業獲利效率的重點因素。最後,本研究希望根據實證結果分析給予產業界及學界之未來研究建議。
    Recently, many merger and acquisition cases have occurred between the enterprises of the semiconductor assembly and testing industry. To imply about how it happened and how will it influence the whole industry,this thesis present a study which utilizes the input oriented CCR model and BCC model of two-stage Data Envelopment Analysis (DEA), which separates R&D efficiency and profitability efficiency to evaluate the performance for the global semiconductor assembly and testing industry. The research targets are enterprises which included in top-10 market share in the industry. Research period of the first stage and second stage respectively is during 2012 to 2014 and 2014 to 2016. In order to deal with the result of DEA, this study takes the Pearson correlation analysis to find relationships between the R&D efficiency and the profitability efficiency. In the R&D efficiency, it take R&D expenses and accumulated patents number as input; while take the number of new patents as output. In the profitability efficiency, it take patent capital and operating expenses as input; while take the operating margin as output. Through the BCC mode DEA, this study finds that most enterprises are efficiently in the technical efficiency part. However, the scale efficiency are worse. Those medium scale enterprises are in the” increasing returns to scale” mode, while the high scale enterprises are in the” decreasing returns to scale” mode. It confirmed that the trend of “The powerful are always powerful”, while those high scale enterprises might suffered in the problem of lake of integration. Finally, we hope the results can provide actual suggestions for both the industry and future research.
    Reference: 英文文獻
    Baker, N., and James Freeland. (1975). Recent advances in R&D benefit measurement and project selection methods. Management science, 21.10 1164-1175.
    Brown, M. G., and Raynold A. Svenson. (1988). Measuring r&d productivity Research-Technology Management, 31.4 11-15.
    Fanelli, H. a. (2002). Action and possibility: Reconciling dual perspectives of knowledge in organizations. Organization Science, 13(3)(290-302).
    Hoang, H. A., and Frank T. Rothaermel. (2010). Leveraging internal and external experience: exploration, exploitation, and R&D project performance. Strategic Management Journal, 31.7 734-758.
    Kim, B., and Heungshik Oh. (2002). Economic Compensation Compositions Preferred by R&D Personnel of Different R&D Typed and Intrinsic Values. R&D Management(32(1)), 47-59.
    Nelson, R. R. (1982). The role of knowledge in R&D efficiency. The quarterly journal of economics, 97.3, 453-470.
    Roll, G. B. a. Y. (1989). An Application Procedure for DEA. Omega 1(3), 237-250.
    Rubenstein, A. H., and Eliezer Geisler. (1991). Evaluating the outputs and impacts of R&D/innovation. International Journal of Technology Management 6.3 181-204.
    Scherer, F. M. (1965). Firm size, market structure, opportunity, and the output of patented inventions
    APA The American Economic Review, 55.5 1097-1125.
    Schumpter, J. A. (1942). Capitalism, Socialism, and Democracy. New York: Harper and Brothers.
    Werner, B. M., and William E. Souder. (1997). Measuring R&D performance—state of the art. Research-Technology Management, 40.2 34-42.
    Zvi Griliches, A. P., Bronwyn H.Hall. (1986). The value of patent as inoicators of inventive activity. Working Paper, 2083.
    中文文獻
    王永達. (2010). 台灣LED產業研發效率與獲利效率及其影響因子分析. (碩士), 國立政治大學, 台北.
    王廷基、麥偉基、黃婷婷、王俊堯、張克正. (2010). 在 System-in-Package 設計下之自動化工具研發總計畫研究成果報告. Retrieved from 行政院國家科學委員會:
    王凱平. (2003). 銀行產業經營效率與生產力分析. (碩士), 國立政治大學, 台北市. (91258010)
    吳佳瑋. (2005). 研發投入與產出對於企業經營績效之遞延效果-以我國電子業上市上櫃公司為例. (碩士), 政治大學.
    吳淑美. (2016). 由封測大廠併購事件 看兩岸半導體產業競合態勢. 證券服務, 648, 85-88.
    吳濟華、何柏正. (2008). 組織效率與生產力評估:資料包絡分析法. 台北縣: 前程文化事業有限公司.
    呂正欽、高淩菁、傅新彬. (2016). 應用ICA與DEA方法評估半導體產業封測領域公司經營績效­-以台灣中型半導體封測廠為例. 中山管理評論, 503-530. doi:10.6160/2016.09.03
    李揚、鐘棠祺. (2015). 半導體產業之績效評估­-跨國分析與比較. 東吳經紀商學學報, 61-88.
    邱垂昌、王育民、魏嘉伶、張簡婷. (2011). 創新、人力資本投入與企業經營效率-以我國IC設計業為例. 中山管理評論, 343-385.
    高強;黃旭男;末吉俊幸. (2003). 管理績效評估:資料包絡分析法. 台北市: 華泰文化事業公司出版.
    黃建雄. (2008). 台灣半導體產業研發效率與研發獲利能力之分析-以IC產業為例. (碩士論文), 真理大學.
    楊美蘭. (2005). 台灣IC設計業研發效率與影響因子分析. (碩士), 國立政治大學.
    蔡榮發、張淑娟、張原嘉. (2016). 台灣上市半導體公司經營績效評估與分析. 創新與管理, 26.
    簡菁凡. (2005). 專利指標對台灣半導體產業創新研發績效之影響. (碩士), 開南管理學院.
    李東杰、鄭雅云、薛金愛. (2011). 上市、櫃及公開發行之太陽能廠商的績效與
    影響因素分析. 南台學報, 第 36 卷第 4 期, 47—62.
    謝榮明. (2006). 台灣TFT-LCD大尺寸液晶面板廠商研發效率與影響因子分析. (碩士), 國立政治大學.
    Description: 碩士
    國立政治大學
    科技管理與智慧財產研究所
    104364117
    Source URI: http://thesis.lib.nccu.edu.tw/record/#G0104364117
    Data Type: thesis
    Appears in Collections:[科技管理與智慧財產研究所] 學位論文

    Files in This Item:

    File SizeFormat
    411701.pdf1672KbAdobe PDF2584View/Open


    All items in 政大典藏 are protected by copyright, with all rights reserved.


    社群 sharing

    著作權政策宣告 Copyright Announcement
    1.本網站之數位內容為國立政治大學所收錄之機構典藏,無償提供學術研究與公眾教育等公益性使用,惟仍請適度,合理使用本網站之內容,以尊重著作權人之權益。商業上之利用,則請先取得著作權人之授權。
    The digital content of this website is part of National Chengchi University Institutional Repository. It provides free access to academic research and public education for non-commercial use. Please utilize it in a proper and reasonable manner and respect the rights of copyright owners. For commercial use, please obtain authorization from the copyright owner in advance.

    2.本網站之製作,已盡力防止侵害著作權人之權益,如仍發現本網站之數位內容有侵害著作權人權益情事者,請權利人通知本網站維護人員(nccur@nccu.edu.tw),維護人員將立即採取移除該數位著作等補救措施。
    NCCU Institutional Repository is made to protect the interests of copyright owners. If you believe that any material on the website infringes copyright, please contact our staff(nccur@nccu.edu.tw). We will remove the work from the repository and investigate your claim.
    DSpace Software Copyright © 2002-2004  MIT &  Hewlett-Packard  /   Enhanced by   NTU Library IR team Copyright ©   - Feedback