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| Title: | 半導體整合元件(IDM)廠競爭策略調整之研究 -以I公司為例
Research on Competitive Strategy Adjustment of IDM (Integrated Device Manufacturing) Company -A case study of I Company |
| Authors: | 王立廷
Wang, Li-Ting |
| Contributors: | 詹文男
尚孝純
Tsan, Wen-Nang
Shang, Shiaw-Chun
王立廷
Wang, Li-Ting |
| Keywords: | 半導體
總體環境分析
五力分析
SWOT
IDM2.0
Semiconductor
PEST analysis
Five forces analysis
SWOT analysis
IDM2.0 |
| Date: | 2023 |
| Issue Date: | 2023-09-01 15:08:15 (UTC+8) |
| Abstract: | 過去的 50 年來，因為電晶體的發明帶動了半導體產業發展，加速第三次工業革命，使人類的生產力快速的進步;其中 I 公司生產的微處理器(CPU)更是提 供源源不斷的計算力的進步，然而近幾年來 I 公司逐漸的在營收與成長率逐漸的 降低，因應這樣的挑戰，I 公司提出了一個 IDM2.0 的策略。
本研究的研究採用質性個案分析法，包含訪談在半導體產業中相對於個案 I 公司中不同的競爭關係的關係人，除此之外，也研究公開資料包含個案公司財報 與新聞稿，產業研究調查報告跟產經新聞等來探討個案 I 公司在整個產業的競爭 中面臨什麼樣的問題，以及 I 公司根據自身怎樣的優勢在 2021 年提出調整策略 IDM2.0，最後討論未來調整之後可能遇到什麼風險與挑戰。
藉由五力分析，本研究發現個案公司面臨了高強度的既有競爭者威脅，也面 臨了中強度的替代品威脅，而其主要的原因便是 I 公司堅持自己開發與自己生產 的 IDM 路線，其先進製程技術卻無法取得完全的領先地位，造成競爭者與替代 品紛紛找尋由三星或是台積去做製程代工優化產品;而其調整策略 IDM2.0 是基 於他自己過去的先進製程技術的領先優勢，要持續開發先進製程，並且進入晶圓 代工領域;以及外在的總體環境，尤其是現在的地緣政治緊張，從川普到拜登大 至上都是推行『美國製造』的政策，給 I 公司一個高度的機會:筆者分析 I 公司 IDM2.0 是根據最佳化的優勢-機會(S-O)策略所訂立;最後筆者分析此策略最大 的風險是在新進製程開發的進度，一但開發的不順利，無法取得預期的領先，除 了影響先進製程製造的高階產品之外，更會影響到建立晶圓代工的事業，最後筆 者給一個戰略上的建議，請個案公司屏除 IDM 思維，改採製造外包的無廠半導 體策略，來加大自身的競爭優勢。
In the past 50 years, the invention of the transistor has driven the development of the semiconductor industry and accelerated the third industrial revolution, leading to rapid progress in human productivity. The microprocessors (CPUs) produced by Company I have provided a continuous stream of computing power improvements. However, in recent years, Company I has gradually experienced a decline in revenue and growth rate. To address this challenge, Company I has proposed an IDM2.0 strategy.
This study employs a qualitative case analysis method, including interviews with stakeholders in the semiconductor industry who have different competitive relationships with Company I. In addition, publicly available data such as the company`s financial reports and press releases, industry research reports, and business news are examined to investigate the problems that Company I faces in the entire industry competition, and how Company I proposes to adjust its strategy based on its own advantages in 2021 through IDM2.0. Finally, the potential risks and challenges that may arise after the adjustment are discussed.
Through a five forces analysis, this study finds that Company I faces a high intensity of threats from existing competitors as well as medium intensity of threats from substitutes. The main reason for this is that Company I insists on its own IDM route of development and production, but its advanced process technology cannot achieve a complete leading position. This has caused competitors and substitutes to seek optimization of products through outsourcing to Samsung or TSMC. The IDM2.0 adjustment strategy is based on Company I`s past advantage in advanced process technology to continue developing advanced processes and entering the wafer foundry field, as well as the external macro environment, especially the current geopolitical tensions. From Trump to Biden, there is a strong policy promoting "Made in America," which presents a great opportunity for Company I. The author analyzes that Company I`s IDM2.0 is based on an optimized strengths-opportunities (S-O) strategy. Finally, the author analyzes that the biggest risk of this strategy is the progress of new process development. If it does not progress smoothly and cannot achieve the expected leadership, it will not only affect the production of high-end products using advanced processes, but also affect the establishment of wafer foundry business. The author gives a strategic recommendation to Company I to abandon the IDM mindset and adopt a fabless semiconductor strategy to increase its competitive advantage. |
| Reference: | 中英文書籍
1. Chris Miller,(2022). Chip War, New York: Scribner
2. 周旭華譯/Michael E. Porter 著，(2010)。競爭策略:產業環境與競爭者分析(第
三版)。台北市:天下文化
3. 李明軒,邱如美譯/Michael E. Porter 著，(2010)。競爭優勢(第二版)。台北
市:遠見天下文化
4. 卓惠娟譯/太田泰彥著，(2022)。半導體地緣政治學。台北市:野人文化
中英文期刊
1. H. Weihrich, (1982). The TOWS Matrix a Tool for Situational Analysis. Long
Range Planning, Vol. 15, No. 2, pp. 54-66
2. Michal E. Porter, (1979). How competitive forces shape strategy. Harvard
Business Review, March-April, pp.137
3. Michal E. Porter, (1996). What is strategy. Harvard Business Review,
November-December, pp.61
4. Semiconductor Content in Electronic Systems Reached Record High in 2021,
from: https://www.eetasia.com/semiconductor-content-in-electronic-systems-
reached-record-high-in-2021/
網際網路
1. 半導體產業鏈簡介, from https://ic.tpex.org.tw/introduce.php?ic=D000
2. 英特爾執行長 Pat Gelsinger 宣布:匯聚製造力、創新力和產品領導力的
IDM2.0 策略，from https://benchlife.info/intel-ceo-pat-gelsinger-announced- idm2-0-strategy-that-converges-manufacturing-innovation-and-product- leadership/
3. AMD Steals More Of Intel`s Lunch Money, Capturing Over 30% X86 CPU Market Share, fromhttps://hothardware.com/news/amd-steals-intels-lunch-
money-increasing-cpu-market-share
4. AMD vs Intel Market Share (All CPUs),from
https://www.cpubenchmark.net/market_share.html
5. Hardware Trends & The Future , fromhttps://www.clickedonline.co.uk/2022/11/04/hardware-trends-the-future/
6. 大數字/全球伺服器出貨成長趨緩, Retrieved Arp.,1st ,2023, fromhttps://udn.com/news/story/7240/7056552?from=udn_ch2_menu_v2_main_ cate
7. Worldwide Server Market Spending Slightly Declining in 2023 but Expected to Continue with a CAGR of 7.7% in a Five-Year Period, According to IDC, from https://www.idc.com/promo/servers
8. AMD will Capture More than 30% of the Server CPU Market in 2023 with 4th Gen Epyc Genoa: Analysis, from https://www.hardwaretimes.com/amd-will- capture-more-than-30-of-the-server-cpu-market-in-2023-with-4th-gen-epyc- genoa-analyst/
9. 美國-消費者物價指數[CPI]，from 財經M平方網站 https://www.macromicro.me/collections/5/us-price-relative/10/cpi
10. 美 國 - 基 準 利 率 ， from 財 經 M 平 方 網 站 https://www.macromicro.me/charts/48/target-rate |
| Description: | 碩士
國立政治大學
經營管理碩士學程(EMBA)
109932064 |
| Source URI: | http://thesis.lib.nccu.edu.tw/record/#G0109932064 |
| Data Type: | thesis |
| Appears in Collections: | [經營管理碩士學程EMBA] 學位論文
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| 206401.pdf | | 7359Kb | Adobe PDF2 | 53 | View/Open |
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