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    Title: 探討調適性學習行為-以半導體工程師排除晶圓缺陷工作實務為例
    Adaptive learning in semiconductor industry
    Authors: 陳維中
    Contributors: 蕭瑞麟
    Xiao, Ruey Lin
    陳維中
    Keywords: 情境學習
    調適性學習
    situated learning
    adaptive learning
    Date: 2010
    Issue Date: 2011-09-29 16:41:13 (UTC+8)
    Abstract: 我國專業晶圓代工產業已是全球半導體產業鏈中不可或缺一環,此創新之商業模式不但帶動了全球半導體產業鏈的重整,更為我國半導體產業奠定了雄厚的基礎。但是無法快速回應晶圓缺陷問題與縮短工程師培訓時間,卻仍是台灣半導體產業發展近四十幾年來的瓶頸。此問題的延誤不傴使晶圓廠耗損巨額的成本,更承擔喪失國際客戶訂單的風險。因此,如何使半導體工程師提升工作效率,與如何有效培養新進工程師,如今已成為半導體業界刻不容緩之議題。
    在知識經濟時代中,為企業打造適宜之知識管理模式是產、官、學界所致力的目標。但多數的研究以資訊科技所主導的知識管理系統為範疇,鮮少研究去探索知識工作者陎臨求解問題的困境中,是如何依循著問題情境,如何在其中摸索,進而發展出解決方案的詳細過程。有鑑於此,本研究選擇以詮釋型個案研究方法,深入訪察半導體工程師工作實務,藉此瞭解工程師於維修情境中排除晶圓缺陷的樣貌。
    經由探討排除晶圓缺陷的工作實務中發現,工程師具備了四禑與「情境」調適性學習(adaptive learning)((Tyre and von Hippel,1997)的歷程:第一、工程師必頇在問題情境中,辨認隱藏於情境當中之線索,並賦與線索意義而展開偵察行動。第二、工程師在偵察過程中,頇不斷地依情境調整收集資料技巧,挖掘出更多或更深層的資訊。第三、工程師適當的工具與資源,有效率地萃取更多的資訊。第四、工程師彼此之間依情境發展出最適行為模式,得以順利整合跨部門執行偵察行動。
    本研究著重於解析工程師在問題情境中,不斷學習與調適之詳細過程,並指出調適性學習如何在排除晶圓異常工作中扮演重要的角色。最後,針對調適性學習行為提出具體的理論與實務意涵,以供組織未來進行人員培訓與知識管理之參考。
    第一章 緒論.................................................................................................................. 1
    第一節、研究背景與動機.................................................................................... 1
    第二節、研究目的與研究問題............................................................................ 3
    第三節、論文章節安排........................................................................................ 7
    第二章 文獻探討.......................................................................................................... 8
    第一節、情境學習(situated learning) .................................................................. 9
    一、不具「絕對性」的知識........................................................................ 9
    二、不具「可攜性」的知識........................................................................ 9
    第二節、在實踐中學習(learning in practices) .................................................. 10
    第三節、在社會互動中學習(learning in social interactions) ............................ 13
    第四節、在實體情境中學習(learning in physical contexts) ............................. 14
    第五節、調適性學習(adaptive learning) ........................................................... 15
    第三章 研究方法........................................................................................................ 18
    第一節、個案選擇.............................................................................................. 19
    第二節、資料搜集.............................................................................................. 23
    一、實地參與觀察(Participant Observation) ............................................. 23
    二、訪談(Interviews) .................................................................................. 24
    三、資料文件(Documents) ......................................................................... 25
    第三節、資料分析.............................................................................................. 26
    第四章 研究發現........................................................................................................ 29
    第一節、晶圓缺陷排除工作實務...................................................................... 31
    第二節、個案一:晶圓編號中的玄機.............................................................. 35
    一、抽絲剝繭.............................................................................................. 36
    二、擴大的災情.......................................................................................... 37
    三、击起的軟墊與3的倍數...................................................................... 39
    四、 調適性學習行為描述.................................................................. 42
    第三節、晶圓缺陷排除個案二:刮痕背後的真相.......................................... 52
    一、兩道直線型刮痕.................................................................................. 52
    二、來自機器手臂的訊息.......................................................................... 54
    三、偵察新契機.......................................................................................... 56
    四、人為的疏失.......................................................................................... 58
    五、調適性學習行為描述.......................................................................... 58
    第四節、晶圓缺陷排除個案三:晶圓切片手術.............................................. 69
    一、龐大的污染物...................................................................................... 69
    二、晶圓檢驗室.......................................................................................... 71
    三、蝕刻部門的質疑.................................................................................. 73
    iii
    四、污染物成份分析.................................................................................. 76
    五、老舊的晶圓匣...................................................................................... 77
    六、調適性學習行為描述.......................................................................... 78
    第五節、調適性學習行為模式分析.................................................................. 86
    一、調適性學習行為模式分析.................................................................. 86
    第五章 討論................................................................................................................ 91
    第一節、理論意涵.............................................................................................. 91
    第二節、實務意涵.............................................................................................. 96
    第六章 結論與建議.................................................................................................... 98
    第一節、研究結論.............................................................................................. 98
    第二節、研究限制.............................................................................................. 99
    第三節、研究建議.............................................................................................. 99
    參考文獻.................................................................................................................... 100
    一、英文部分.................................................................................................... 100
    圖目錄
    圖3-1 我國半導體專業分工產業鏈 ......................................................................... 19
    圖4-1軟墊位置示意圖 .............................................................................................. 39
    圖4-2 晶圓損傷示意圖 ............................................................................................. 52
    表目錄
    表3-1 我國半導體產業產值 ..................................................................................... 20
    表3-2 訪談人數表 ..................................................................................................... 25
    表4-1、調適性學習表格(個案一) ....................................................................... 44
    表4-1(續)、調適性學習表格(個案一)................................................................. 45
    表4-1(續)、調適性學習表格(個案一)................................................................. 46
    表4-1(續)、調適性學習表格(個案一)................................................................. 47
    表4-2 調適性學習圖表(個案二) ......................................................................... 59
    表4-2(續) 調適性學習圖表(個案二) ............................................................. 60
    表4-2(續) 調適性學習圖表(個案二) ............................................................. 61
    表4-2(續) 調適性學習圖表(個案二) ............................................................. 62
    表4-2(續) 調適性學習圖表(個案二) ............................................................. 63
    表4-2(續) 調適性學習圖表(個案二) ............................................................. 64
    表4-3 調適性學習圖表(個案三) ......................................................................... 79
    表4-3(續) 調適性學習圖表(個案三) ............................................................. 80
    表4-3(續) 調適性學習圖表(個案三) ............................................................. 81
    iv
    表4-5 學習如何將既有知識運用於情境之中 ......................................................... 87
    表4-6 學習如何在情境中持續學習 ......................................................................... 88
    表4-7 學習如何在不同情境中相輔相成 ................................................................. 90
    表5-1 調適性學習比較 ............................................................................................. 94
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    Description: 碩士
    國立政治大學
    科技管理研究所
    96359020
    99
    Source URI: http://thesis.lib.nccu.edu.tw/record/#G0096359020
    Data Type: thesis
    Appears in Collections:[科技管理研究所] 學位論文

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