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    Title: 晶圓製程設備產業智慧資源規劃之研究
    The Research of Intelligence Resources Planning of Wafer Fabrication Equipment Industry
    Authors: 沈志祥
    Shian, Shen
    Contributors: 周延鵬
    劉江彬

    沈志祥
    Shian, Shen
    Keywords: 半導體產業
    晶圓製程設備
    智慧資源規劃
    Semiconductor Industry
    Wafer Fabrication Equipment
    ntellectual Resource Planning
    High-k/Metal Gate
    Date: 2007
    Issue Date: 2009-09-17 18:40:45 (UTC+8)
    Abstract: 晶圓製程設備商必須充分利用全球化智慧資源規劃,發展企業策略,才能創造企業競爭力和成長動能。經過多次的景氣循環,晶圓設備產業已經成為少數廠商全球激烈競爭的環境,特別是仍有兩家設備供應商以上的產品線。對於客戶而言,購買設備的主要因素來自於廠商製程能力和成本的優勢。除了少數關鍵製程由一家壟斷外,客戶都可以在每一個新製程世代(Technology node)找到兩家廠商評估設備和技術需求。在贏者全拿的壓力與吸引力下,在每一個新製程世代的銷售週期中,晶圓設備商都必須要充分利用智慧資本化的效益,掌握客戶的技術、量產時程,才能確保銷售空間。在發展策略上,為面對高技術競爭但是低成長的產業環境,晶圓設備商必須要透過併購和整合其核心技術相關新事業才能同時整合既有智慧資源和創造成長。

    不管從市場規模和產業鏈來看,台灣的半導體產業已經成為全球最重要的製造據點,也是台灣最重要的產業之一。半導體製造廠龐大的資本支出和相關需求更讓台灣成為各半導體設備商的銷售服務的兵家必爭之地。根據SEMI的最新市場調查,總計台灣2007年的半導體設備市場達到106.5億美元,較2006年大幅成長45.2%,正式超越日本成為全球最大半導體設備投資市場。在產業鏈中,晶圓製程設備除了是晶圓廠最大資本支出外,還是產業技術發展的供應者。很可惜的是,雖然擁有龐大的商機做後盾,台灣卻沒有及時發展這個領域。在轉換成本、專利、和領導晶圓製造商合作開發和人才、資金等高產業門檻下,除了自動化設備較有進展外,台灣在晶圓製程設備產業的自給率普遍低於5%,技術、智財和人才還是掌握在外國的晶圓製程設備廠商。在沒有整合產、官、學、研等資源和適合的智財管理規劃下,在需要高度基礎科學和長遠技術發展的晶圓製程設備產業,我們設備自制化的結果不高,並不令人訝異。晶圓製造業者的議價和技術自主能力因此而受到拘束,所發展的智財也沒有太大價值和效用。

    本研究目的希望以智慧資源規劃為研究方法,進行晶圓製程設備產業的實證研究。先就市場特性分析晶圓製程設備產業概況,接著探討廠商如何運用智慧資源規劃的資本化和產業結構化切入市場,最後在實證研究上以分析主要晶圓製程設備廠商的專利能量和最新奈米技術High-k/Metal Metal Gate探討產業的技術發展趨勢與廠商智慧資源規劃的運用和佈署。期望從綜合上述論點,做為台灣是否適合發展晶圓製程設備和又該如何準備智慧資源規劃的參考。
    Global intellectual resource planning (IRP) is cruicial in industrial strategy for wafer fabrication equipment vendors to develop competence and growth momentums. After several business cycles during the past few decades, this industry has become a very competitive market of a few players. For their customers, the key decision factors are the technology capability and cost of the vendors. Except for some critical process equipments dominated by only one vendor, the customers can identify 2 vendors to evaluate their equipment and cost performance. That Winner takes all become the pressure and attraction of the industry. The vendors must fully apply the value of intellectual property and overhaul their customer’s technology and production roadmap to ensure their share in the market. To cope with the market challenges of low growth and highly competitiveness, the vendors must incoporate and integrate other new companies of their core technology to consolidate given intellectual resource and create better achievements.

    Either from the perspective of market size and industry value chain, Taiwan has played the most important role in semiconductor manufacturing industry worldwide. To extend their market share and keep in the lead, the foundry and DRAM companies have aggressively invested in the production of 300mm fabs. The vast investments and its production demands have made Taiwan the most competitive place in semiconductor equipment markets. According to the SEMI most update, the business volume of Taiwan semiconductor equipments market reached to US$10.65 billion in 2007, with an impressive growth of 45.2% more than 2006. Taiwan has overtaken Japan and become the largest semiconductor equipment markets in the world. In the industry value chain, the wafer fabrication equipments not only accounted for the greatest capital expenditure of fibs but also the foundation for the process technology development. It is a pity that the equipments industry in Taiwan did not flourish as along with the great market here. All the key technologies, people, materials and components are manipulated by foreign vendors. This situation resulted in an un-balanced development in domestic semiconductor industry as well as the bargain power and self-owned technology. The related developed intellectual rights can not show the real value and effect. With the high entry barriers of transfer cost, patents, professionals and investments of wafer fabrication equipments markets, Taiwan vendors take less than 5% in the market share, except for some progress in automation equipments of lower IP, capital and transfer cost barriers. The Taiwan vendors have not demonstrated capability in process technology to penetrate the markets. The wafer fabrication equipment market growth was a result of o the outsource investment from Europe, US and Japan fabs. It turns out that the technology, IP and people are still possessed by foreign vendors. Without the synergy and integration of government, academia and industry and intangible resource planning, it is not surprising that our production localization ratio is relatively low.

    Thus, the thesis will elaborate the case study in the way of intellectual resource planning. First, the research will analyze the industrial characteristics of wafer fabrication equipment market. In the followings, this research will discuss how vendors can apply IRP to penetrate the market. Finally, this research will analyze the patents of major vendors and High-k/Metal Gate process technology to elaborate the industry technology cycles and new technology development strategy. As a result, the thesis will try to discuss if it is suitable for Taiwan to develop the wafer fabrication equipment market and also serve for reference how to prepare the intellectual resource planning.
    Reference: 壹、 中文資料
    一、 專書及論文
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    二、 期刊及研究報告
    1.工研院金屬中心,2007機械年鑑-半導體製程設備,2007/10
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    商品化、產業化與專利佈局思考,2006/6/7,http://cdnet.stpi.org.tw/techroom/analysis/pat_A044.htm
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    三、 報導
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    2.ASMI與Hitachi簽署原子層沉積技術授權協定,電子工程專輯,http://www.eettaiwan.com/ART_8800492020_480202_NT_2ad1250a.HTM
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    4.李佳玲 半導體奈米製程迎戰新High k/ Low K材料技術 ,電子時報,2008/3/3 十週年系列特別報導-摩爾定律驅動半導體產業世代進化,電子時報,2008/4/28
    5.宋建民 先進半導體製程與材料選擇 電子時報,2008/3/3
    6.宋丁儀
    應材推出45奈米以下ALD 支援鉿元素 業界預料首大客戶是英特爾並為ALD市場投下震撼彈
    國內45、32奈米製程研發商機現 InterMolecular與晶圓代工廠合作,電子時報,2007/7/31
    360度科技-ALD電子時報,2007/7/19
    與摩爾定律做好朋友 樂見E-Beam、EUV都成功
    台積電45奈米、32奈米low-k銅製程可順利完成驗證,電子時報,2007/6/4
    Crolles2將瓦解 恩智浦率先賣設備!台積電、恩智浦研發聯盟取而代之 開發先進製程、利基市場應用,電子時報,2007/12/13,http://www.digitimes.com.tw/n/article.asp?id=0000075868_A676F7759C7BIJU758VCA
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    12.郭長祐
    矽絕緣(SOI)製程技術發展分析,電子時報,2007/09/12
    Low k、High k到底在幹嘛?電子時報,2007/12/24
    技術洞察─MOS持續無法「名符其實」,電子時報,2008/1/14
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    20.盧慶儒 面對奈米製程 材料的整合難度更高 2007/9/13
    貳、 英文資料
    一、 期刊和報導
    1.Bryan Lewis, Semiconductor Industry Update – Searching for Opportunities, Gartner, 2007/7
    2.Darel Sin, Sanjay Malhotra, The DRAM Upswing
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    8.Mark LaPedus, Used fab gear to flood market, 2008/1/10, ttp://www.semico.com/mediacov/2008-01/2008-01-10%20EETimes.pdf
    9.Robert Bachrach, Mark Pool, Karen Genovese, JC Moran, Applied Materials, Inc.; Michael D. O’Halloran, Thomas J. Connolly, IDC,2003/04
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    11.Tony Pan, CP Chan, Hans Stork, Highlights of Chip Structure Analysis Report on Intel 45nm Penryn Processor w/High K Metal Gate and Related 2007 IDEM Papers- 2007/12
    二、 網站
    1.Aixtron, http://www.aixtron.com/index.php?id=2&L=1
    2.Applied News, http://www.businesswire.com/portal/site/appliedmaterials/menuitem.7ff9ad9e8388b30ffc974d10e6908a0c/?searchHereRadio=false&ndmHsc=v2*A0*J2*L1*N-1002313*Zacquisition
    3.Applied Materials, http://www.applied materials.com
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    8.LAM Research, http://www.lamresearch.com/company_1.cfm
    9.Novellus, http://www.novellus.com/default.aspx
    10.Nikon, http://www.nikon.com/about/info/history/products/index.htm
    11.SEMI, Semiconductor Equipment and Materials International, http://wps2a.semi.org/wps/portal/_pagr/136/_pa.136/699
    12.SEMI Tech, http://www.semitech.net/
    13.SIA, Semiconductor Industry Association, http://www.sia-online.org/home.cfm
    14.SI, Semiconductor International, http://www.semiconductor.net/
    15.SICAS, Semiconductor International Capacity, http://www.sicas.info/index.html
    16.Tokyo Electron, http://www.tel.com/eng/
    17.Wafer News, http://www.wafernews.com
    18.Worldwide semiconductor trade statistics, http://www.wsts.org
    Description: 碩士
    國立政治大學
    智慧財產研究所
    93361011
    96
    Source URI: http://thesis.lib.nccu.edu.tw/record/#G0093361011
    Data Type: thesis
    Appears in Collections:[智慧財產研究所] 學位論文

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